Since Runcom introduced its proprietary Orthogonal Frequency Division Multiple Access (OFDMA®) technology to the world in 2000, it has been enthusiastically embraced as the next generation international standard by the prestigious governing boards that are defining the direction of the wireless arena, including: the Digital Video Broadcasting (DVB) committee, ETSI-BRAN and IEEE 802.16a/d/e.
Consequently, OFDMA® now provides the basic infrastructure for the DVB-RCT/ETSI broadcasting standard and is the preferred technology driving the BWA market. Moreover, it is being implemented as a leading technology for rolling out 3GPP-LTE and 4G cellular infrastructures.
Runcom’s market-leading OFDMA system-on-chip solutions drive wireless network communications performance in all of these deployments and are available in multiple configurations to suit virtually any need.
RNF2001 SOC for BS
The RNA2001 mobile WiMAX Silicon for MACRO and PICO Base Stations is an advanced implementation of the IEEE802.16e-2005 standard modem and low level MAC layer. The device is fully compliant with the WiMAX Forum “System Proﬁle” and Wave-2 functionalities. The device suppor ts advanced features beyond the WiMAX Forum recommendations such as receive beam forming, transmit beam forming, uplink sounding, ...
IEEE802.16e Rev 2 PHY/MAC SoC
The RNA300 provides high-performance WiMAX Wave 2 and IEE802.16e and Rev2 compliant OFDMA® System on Chip (SoC) for Mobile Subscriber Stations (MSS).
The RNA300 is a highly integrated SoC that provides an optimal solution for OFDMA® MobileSubscriber Systems(MSSs). The RNA300 is self contained and only requires a handful of external components to create a wireless Mobile WiMAX MSS solution with low power consump...
Reference Design Kit
Runcom’s base station and CPE products are available for OEM-s and ODM-s in a form of a reference design kit. Acomplete production database is available with a variety of RF solutions including 1.4-1.8 GHz band, 2.4-2.7 GHz band and3.3-3.8 GHz band.
The reference design kit includes the following design materials:
Complete product manufacturing BOM (mechanics and electronics)
Board design files (Assembly and production gerbers)